Ka ʻIke Huahana
Inoa huahana:6-(2,5-Dihydroxyphenyl)-6H-dibenz[c,e][1,2]oxaphosphorine-6-oxide
Helu Kūʻai:99208-50-1
Kaumaha molekole:324.28
ʻO ke ʻano molekole:C18H13O4P
Waiwai:
Ka nui: 1.38-1.4 (25 ℃)
Kiko heheʻe: 245 ℃ ~ 253 ℃
Papa kuhikuhi loea:
| helehelena | Pauka keʻokeʻo |
| Hoʻāʻo (HPLC) | ≥99.1% |
| P | ≥9.5% |
| Cl | ≤50ppm |
| Fe | ≤20ppm |
Noi:
ʻO Plamtar-DOPO-HQ kahi mea pale ahi phosphate halogen-free hou, no ka resin epoxy kiʻekiʻe e like me PCB, e pani iā TBBA, a i ʻole ka mea hoʻopili no ka semiconductor, PCB, LED a pēlā aku. Waena no ka synthesis o ka mea pale ahi reactive.
ʻŌpala a me ka mālama ʻana:
E mālama i kahi maloʻo a anuanu. E mālama ʻia mai nā kumu wela a pale i ka ʻike pololei ʻana i ka mālamalama.
20KG/ʻeke (ʻeke pepa i hoʻopaʻa ʻia me ka palakiko) a i ʻole e like me nā koi a ka mea kūʻai aku.